● Special Bonding Application Tape is a professional bonding solution designed to meet the needs of complex environments, precision processes or extreme conditions in electronic products. Compared with the general tape, it achieves breakthroughs in key performance through material innovation, structural optimization and process improvement.
● Chemical-resistant tape/ high peeling force, good die-cutting performance and dimensional stability, excellent chemical resistance, suitable for bonding protection of screen and back cover, and sealing and fixing of interface and sensor.
● Ultra-thin tape/ ultra-thin design, high adhesion, low thermal resistance, high cleanliness, suitable for NFC/wireless charging coil structure fixing, led backlight functional sheet fixing.
Grid tape/ excellent exhaust, good die-cutting, high dimensional stability, suitable for graphite, nanocrystalline, copper foil bonding.
● Reflow resistant tape/ strong initial adhesion, good compliance, high temperature resistance to reflow, easy stripping of release material, suitable for reflow (SMT) process bonding.
Conventional bonding application
High-performance bonding application
Special bonding application
Cushioning application/ PE foam tape
Cushioning application/ EPT (acrylic foam tape)
Cushioning application/ PU foam tape
Cushioning applications/ foldable foam
Disassembly application on demand/ easy-to-disassemble tape
Disassembly application on demand/ heat reducing tape
High-strength bonding application/ TSF thermosetting adhesive film
The flexible plate is grounded
Electromagnetic shielding
Adhesion and shield of functional sheet of LCD display module
Adhesion of functional sheet of display module
Screen saver
Consumer market protective film
OLED fitting
Anti-explosion reinforcement of glass back cov of mobile phones