CROWN Absorber Materials Series: Multi-Band EMI Mitigation for Stable Electronic Performance

As smartphones, laptops, wireless charging systems, RFID, NFC, and high-speed communication devices continue to evolve toward higher integration and higher frequencies, electromagnetic interference (EMI) between internal electronic components is becoming increasingly prominent. Effectively reducing EMI and signal crosstalk while maintaining slim, highly integrated device designs has become a key technical challenge in electronic product design and manufacturing.

CROWN absorber materials are composite materials made from soft magnetic alloy powders and polymer materials. They are manufactured by blending, coating, and laminating flake-shaped soft magnetic alloy powders with polymers. Combining the characteristics of soft magnetic materials with effective electromagnetic-wave absorption, these materials help mitigate EMI and signal crosstalk, enhancing the stability and reliability of electronic devices.

To address the electromagnetic compatibility (EMC) requirements of different devices and applications, CROWN New Materials has developed Standard, High-Frequency, and Composite Absorber Materials, covering different frequency ranges and structural requirements to provide flexible EMC solutions.

Standard Absorber Materials

Featuring an ultra-thin profile, excellent die-cutting performance, and outstanding aging resistance, these materials are designed for EMI mitigation in the 0–3 GHz frequency range and meet the requirements of compact and slim electronic devices.

High-Frequency Absorber Materials

With excellent flexibility, multiple thickness options, and outstanding aging resistance, these materials are designed for EMI mitigation in the 1–10 GHz frequency range, supporting high-frequency communication applications such as Wi-Fi and high-speed electronic devices.

Composite Absorber Materials

These materials can be custom-designed and laminated according to specific customer requirements. They can be combined with functional materials such as conductive fabrics and PET films, addressing customized EMI mitigation needs in complex electronic structures.

With a range of frequency bands, thicknesses, and structural configurations, CROWN absorber materials can be applied to various electronic devices and communication scenarios, including smartphones, laptops, wireless charging systems, RFID, NFC, and Wi-Fi.

Applications in Smartphones

Inside smartphones, absorber materials can be locally applied to different interference sources:

• Shielding Cans: Applied to the inner surface of shielding cans to reduce EMI and signal crosstalk.
• Display Backplanes: Applied behind the display backplane to reduce interference from internal electromagnetic fields to the display module.
• Electromagnetic Touchscreens: Applied behind the display module FPC to reduce attenuation of the stylus magnetic field caused by metal backplanes.
• COF Areas: Absorbing or conductive materials can be applied to reduce interference from external electromagnetic fields to display ICs.
• FPCs: Applied to FPC surfaces to reduce radiated interference generated by electronic signals.
• NFC: Used to reduce the impact of metal components on NFC signals and improve near-field communication performance.

Applications in Laptops

To address electromagnetic crosstalk caused by high-speed interfaces, high-frequency communication modules, and highly integrated components, absorber materials can be applied to:

• USB 3.0 interfaces 
• Wi-Fi modules 
• Under main chipsets on motherboards, reducing crosstalk between modules
• Both sides of memory modules, reducing EMI generated during high-speed operation
• Areas surrounding main chipsets, minimizing electromagnetic crosstalk between modules

Beyond smartphones and laptops, CROWN absorber materials are also used in wireless charging, RFID, NFC, and Wi-Fi applications.

From material selection and structural design to application matching, CROWN New Materials continues to develop materials around the EMC requirements of electronic devices, providing absorber material solutions covering different frequency bands, structures, and application scenarios.

As high-speed computing, AI, smart devices, and automotive electronics continue to advance, the electromagnetic environments inside electronic devices will become increasingly complex. CROWN New Materials will continue to advance absorber materials toward thinner, higher-frequency, more integrated, and more customized solutions, helping electronic devices achieve more stable and reliable performance.